TOK TLDP-300 laser-process protective coating

Tokyo Ohka Kogyo Co., Ltd. · Material properties and interface engineering

Purpose: Include protective coating and removal as variables when comparing laser-processing surface contamination and damage.
Technical approach: TLDP-300 is a water-soluble resin solution used as a wafer-surface protective layer during laser processing.
Scope of use: For wafer laser processing, with stack, laser conditions and subsequent cleaning compatibility confirmed individually.
Limitations and open questions: These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitations
Protection does not guarantee zero particles, residue or heat-affected zones, or repair existing damage. Water solubility does not establish device wash compatibility.
What to prepare
BLNKK suggests gathering stack/surface materials, wavelength and pulse/energy, coating/thermal histories, cleaning constraints and defect images.
Confirm with the supplier
Confirm thickness, coating/drying/removal, laser/material compatibility and comparison methods for residue, particles and cross-sectional damage.
Public evidence: The named section identifies the formulation and application, with processing/cleaning images rather than project-specific damage or residue specifications.

Contact the supplier

Find the company’s contact details and ask about this solution through its official channels.