3D Flex WLCSP ball / bump coplanarity inspection
Cohu · Packaging processes and engineering validation
- Purpose
- WLCSP ball or bump height distributions and coplanarity need inspection alongside package-body topography.
- Technical approach
- 3D Flex combines Moiré interferometry, projected patterns and non-contact 2D images to reconstruct 3D topography.
- Scope of use
- Consider it for optically accessible WLCSP contacts, with device surfaces and handling assessed on samples.
- Limitations and open questions
These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitationsExternal optical inspection is not buried-joint inspection or proof of electrical contact or thermal-cycling reliability.
What to prepareBLNKK suggests preparing contact dimensions and pitch, surface reflectivity, fixtures and height criteria, with reference samples and repeatability comparisons.
Confirm with the supplierConfirm sample visibility and handling, measurement datums, calibration and measurement-system analysis.
- Public evidence
- The official page lists height, coplanarity and body-warpage measurements and compatible platforms.
Contact the supplier
Find the company’s contact details and ask about this solution through its official channels.
Related engineering problems
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BLNKK organizes information from public sources. A company profile does not imply a documented solution. Applicability still needs confirmation against your samples and engineering conditions.