SC-80EX stepped / through-hole substrate spray coating
SCREEN Semiconductor Solutions · Packaging processes and engineering validation
- Purpose
- Steps and through-holes can complicate film coverage before patterning.
- Technical approach
- SC-80EX spray-coats three-dimensional substrates, including thick-film applications.
- Scope of use
- Consider nonplanar coating trials, with materials, geometry and downstream lithography confirmed separately.
- Limitations and open questions
These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitationsCoating capability does not qualify fine-line RDL lithography, every hole geometry or electrical isolation.
What to prepareBLNKK suggests preparing viscosity, target thickness, geometry and exposure needs, with coverage and post-development residue observations.
Confirm with the supplierConfirm substrate/material compatibility, configuration and a trial window, including uniformity, residue and subsequent electrical checks.
- Public evidence
- SCREEN's catalogue explicitly describes stepped and through-hole coating for SC-80EX.
Contact the supplier
Find the company’s contact details and ask about this solution through its official channels.
Related engineering problems
These links use established solution relationships. Continue to engineering conditions and evaluation preparation.
BLNKK organizes information from public sources. A company profile does not imply a documented solution. Applicability still needs confirmation against your samples and engineering conditions.