XT H 225 ST 2x non-destructive 3D X-ray CT for advanced packages
Nikon Industrial Metrology · Warpage, topography and stress metrology
- Purpose
- Voids, cracks and assembly misalignment can be hidden inside packages and modules. Inspection starts by establishing whether non-destructive images can resolve the region and defect of interest.
- Technical approach
- XT H 225 ST 2x acquires microfocus X-ray projections from multiple angles and reconstructs CT images with Inspect-X. Targets, scan geometry and acquisition settings can be selected for the specimen.
- Scope of use
- It is an inspection option for internal structures, voids and assembly anomalies in electronic packages and modules. Fine-pitch joints and mixed-material stacks require representative sample trials.
- Limitations and open questions
These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitationsMinimum focal spot size does not establish the smallest detectable defect; voltage, power and spot size also depend on the target. Absorption, magnification and image noise affect results, so fine-pitch bump defect detection cannot be assumed.
What to prepareBLNKK suggests preparing sample dimensions, material stacks, regions and defect sizes of interest, plus an acceptable scan time. Known-good and faulty specimens can help assess images and interpretation.
Confirm with the supplierConfirm demonstrated sample image quality, defect acceptance criteria, target/detector configuration, and the included analysis, calibration and automation functions.
- Public evidence
- The 2023 brochure lists maxima of 225 kV and 450 W and a minimum 1 µm transmission-target focal spot, explicitly warning that all specifications cannot be achieved simultaneously. These are not CT defect-resolution figures.
Supporting references
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BLNKK organizes information from public sources. A company profile does not imply a documented solution. Applicability still needs confirmation against your samples and engineering conditions.