TANAKA ELECTRONICS power bonding wires and ribbons
TANAKA ELECTRONICS Co., Ltd. · Material properties and interface engineering
- Purpose
- Power-bond fatigue comparisons need wire or ribbon assessed with pads, loops and bonding processes.
- Technical approach
- Aluminum or copper wires and aluminum ribbon electrically connect die and substrate electrodes.
- Scope of use
- Consider TANW aluminum wire, TABR aluminum ribbon or CP-1 copper wire, matched to pads and equipment.
- Limitations and open questions
These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitationsProduct capability is not package-fatigue qualification or repair of failed bonds. Validate processes separately for each material.
What to prepareBLNKK suggests preparing pad metallurgy, wire/ribbon geometry, loops, tools and bonding records, alongside pull/shear failure surfaces and loading histories.
Confirm with the supplierConfirm grades, dimensions and bonding compatibility, and comparisons of failure modes and durability after thermal/current loading.
- Public evidence
- The official page names these TANAKA ELECTRONICS products and power-device applications.
Contact the supplier
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BLNKK organizes information from public sources. A company profile does not imply a documented solution. Applicability still needs confirmation against your samples and engineering conditions.