TATSUTA WILMINA SF-PC3900 FPC shielding film
TATSUTA Electric Wire and Cable Co., Ltd. · Material properties and interface engineering
- Purpose
- Package-adjacent EMI evaluation first needs the FPC or grounding coupling path identified.
- Technical approach
- WILMINA SF-PC3900 combines shielding and anisotropic conductive adhesive layers for an FPC shield structure.
- Scope of use
- Consider high-speed FPCs, with R1-C/R2-C grade, lamination and grounding assessed for the actual stack.
- Limitations and open questions
These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitationsIt is not package conformal metallization or system EMC qualification. Material shielding data do not establish grounding or signal-loss compliance.
What to prepareBLNKK suggests preparing FPC stacks, frequency/grounding layouts, lamination records and measurement fixtures for matched-condition comparisons.
Confirm with the supplierConfirm the grade, lamination and ground contact, test methods, shielding effectiveness, insertion loss and durability validation.
- Public evidence
- The official page names both grades, layer construction and FPC applications, with shielding-method reference material.
Contact the supplier
Find the company’s contact details and ask about this solution through its official channels.
Related engineering problems
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BLNKK organizes information from public sources. A company profile does not imply a documented solution. Applicability still needs confirmation against your samples and engineering conditions.