Nippon Kayaku NK disperse UT developer

Nippon Kayaku Co., Ltd. · Material properties and interface engineering

Purpose: Compare pre-plating resist openings and scum to determine whether lithography introduced bridging in initial RDL shorts.
Technical approach: A semiconductor developer forms openings after exposure; performance depends on resist, selected UT grade and development conditions.
Scope of use: Assess the actual RDL resist, metal stack, line/space targets and rinsing workflow.
Limitations and open questions: These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitations
Al/Cu applicability does not guarantee whole-stack corrosion immunity or scum-free openings. Developer cannot repair plated bridges; other cleaners’ conditions do not transfer.
What to prepare
BLNKK suggests preparing resist/thickness, exposure, stack and layout details. Record concentration, time, temperature and rinsing; retain matched images before/after plating.
Confirm with the supplier
Confirm grade/resist/metal compatibility and development/rinse windows. Agree on checks for scum, line shape, corrosion and subsequent plating/electrical results.
Public evidence: Nippon Kayaku lists UT developer features and Al/Cu applicability, not qualification of your RDL stack.

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