KOBUS F.A.S.T. silicon-oxide TSV liners

Plasma-Therm · Packaging processes and engineering validation

Purpose: TSV-liner leakage comparison needs deposition separated from via geometry and electrical background.
Technical approach: KOBUS F.A.S.T. deposits films using separated gas delivery, temporal control and plasma pulsing/controlled gas overlap.
Scope of use: SiO₂ TSV liners are explicitly documented; assess geometry, wafer format and thermal budget.
Limitations and open questions: These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitations
F.A.S.T. is not for every application. Thicker conformal-film descriptions do not establish ALD-level coverage for every via, freedom from pinholes or leakage/breakdown qualification.
What to prepare
BLNKK suggests preparing via geometry, surface/cleaning history, target film/thermal budget, electrical topology, current background and unbroken controls.
Confirm with the supplier
Confirm chemistry/configuration, depth-dependent coverage and contamination assessment, plus representative-via insulation, leakage and breakdown tests.
Public evidence: The linked product/process pages describe thicker conformal films and 2.5D/3D TSV liners.

Supporting references

Find the company’s contact details and ask about this solution through its official channels.