TR7007Q/QI Plus 3D solder-paste inspection
Test Research, Inc. (TRI) · Engineering measurement and characterization
- Purpose
- Reflow-bridge investigation can first compare printed paste amount, location and visible paste bridges.
- Technical approach
- TR7007Q/QI Plus uses multi-direction fringe projection for 3D paste geometry with local board-warpage compensation.
- Scope of use
- Consider compatible printed substrates; published PCB thickness is 0.5–6 mm, with actual fine features validated.
- Limitations and open questions
These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitationsSPI does not inspect buried post-reflow bridges; acceptable paste appearance does not prove no short. Ultrathin substrates/microbumps need separate compatibility checks.
What to prepareBLNKK suggests preparing patterns, paste/stencil, support and measurements correlated with placement, reflow and electrical maps.
Confirm with the supplierConfirm optics, board/support compatibility, warpage compensation, measurement checks and feature-specific bridge, false-call and missed-defect evaluation.
- Public evidence
- The official page lists paste defects and height, area, volume and offset measurement.
Contact the supplier
Find the company’s contact details and ask about this solution through its official channels.
Related engineering problems
These links use established solution relationships. Continue to engineering conditions and evaluation preparation.
BLNKK organizes information from public sources. A company profile does not imply a documented solution. Applicability still needs confirmation against your samples and engineering conditions.