OCA optical surface contact-angle measurement

DataPhysics Instruments · Engineering measurement and characterization

Purpose: Compare wetting after cleaning/activation and waiting periods to flag batch differences in prebond surface preparation.
Technical approach: Dispense liquid, image its contour and calculate contact angles; estimate surface energy using selected probe liquids and a calculation model.
Scope of use: Assess surfaces with accessible droplet placement and clear contours. Wafer positioning, automation and environmental control depend on model/accessories.
Limitations and open questions: These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitations
Contact angle/surface energy alone establish neither cleanliness nor bond strength/yield. Different liquids, readout times or calculation methods are not interchangeable; automated wafer positioning is configuration-dependent.
What to prepare
BLNKK suggests preparing surface/process/storage history, elapsed time and sampling locations. Fix liquid, volume and readout timing; retain images and control-batch results.
Confirm with the supplier
Confirm hardware, liquid compatibility, contour analysis and surface-energy methods. Agree on positioning repeatability, exports and complementary analyses; establish bond-release criteria using actual assembly evidence.
Public evidence: OCA/dpiMAX pages document these methods, without a hybrid-bonding release criterion.

Supporting references

Find the company’s contact details and ask about this solution through its official channels.