FUJIPOLY SARCON thermal gap fillers

Fuji Polymer Industries Co., Ltd. · Material properties and interface engineering

Purpose: Heat-source/sink gaps, loading and insulation needs affect TIM selection.
Technical approach: Pads, gels, sheets or dispensable materials fill gaps to establish thermal contact.
Scope of use: Select by grade-specific thickness, compression, curing and electrical properties, not conductivity alone.
Limitations and open questions: These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitations
Insulation assumptions cannot transfer across lines. Material conductivity does not establish package resistance or retained contact after aging.
What to prepare
BLNKK suggests preparing gaps/tolerances, surface shape, permitted loads and voltage needs, with initial/aged resistance comparisons.
Confirm with the supplier
Confirm grade, compressed thickness/load, insulation, curing, datasheet conditions and supply channels.
Public evidence: The official page lists SARCON forms alongside non-silicone options and a separate non-insulating high-conductivity line.

Contact the supplier

Find the company’s contact details and ask about this solution through its official channels.