TDM temperature-dependent ball and substrate topography

INSIDIX · Engineering measurement and characterization

Purpose: Room-temperature ball height and coplanarity may not describe package geometry during reflow.
Technical approach: TDM uses phase-shifting projection moiré to measure visible 3D surface shape under thermal conditions.
Scope of use: Compare thermal warpage and topography with model-specific validation of ball pitch, reflective surfaces, support and measurement area.
Limitations and open questions: These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitations
Topography does not establish solder wetting or electrical contact. Model capabilities differ; verify fine-pitch ball height on samples.
What to prepare
BLNKK recommends preparing ball geometry, package dimensions, support, temperature profiles and interpretation criteria for room-temperature/thermal comparisons.
Confirm with the supplier
Confirm the model, optics, reflective-surface treatment, actual sample temperature, measurement uncertainty and support effects.
Public evidence: The official page describes thermal topography and lists a BGA ball/substrate coplanarity topic.

Contact the supplier

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