NX20 local prebond surface topography

Park Systems · Engineering measurement and characterization

Purpose: Prebond assessment needs representative roughness and local-height measurements for comparison.
Technical approach: NX20 uses non-contact AFM tip–surface interactions and separate scanners to acquire local topography.
Scope of use: Sample selected regions on larger specimens, with probe, scan extent, calibration and processing matched to the surface.
Limitations and open questions: These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitations
Local scans do not establish wafer-wide particle coverage, chemical cleanliness or bond strength. Large-sample capacity is not an equally large continuous scan.
What to prepare
BLNKK suggests representative surfaces, sampling locations/history, roughness definitions and existing measurements, with processing settings recorded.
Confirm with the supplier
Confirm probes, calibration/repeatability, mounting, environmental conditions and included measurement modes.
Public evidence: The product body and brochure describe non-contact measurement, coordinate navigation and semiconductor surface examples; stage capacity and local scan extent are separate.

Supporting references

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