Cheetah EVO X-ray and laminography inspection for semiconductors
Comet Yxlon · Warpage, topography and stress metrology
- Purpose
- Voids or displaced joints can be hidden inside a package, while sectioning destroys the sample. This platform can establish a nondestructive imaging baseline for die-attach and internal package defects.
- Technical approach
- Microfocus X-ray provides 2D images; CT or computed laminography reconstructs internal features. VoidInspect analyzes joint voids, while quantitative 3D analysis and AI segmentation depend on software configuration.
- Scope of use
- Named applications include die attach, 3D IC joints, TSVs, MEMS and sensors. Comet positions Cheetah EVO for R&D and at-line inspection; visibility of microbumps and complex stacks requires representative sample testing.
- Limitations and open questions
These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitationsVisibility depends on materials, thickness, overlapping geometry and scan configuration. Submicron detail recognition is not a universal detectable-defect specification, and images alone do not establish joint strength or the cause of void formation.
What to prepareBLNKK recommends bringing the package stack, joint materials and thicknesses, target defect locations/sizes, and reference and suspect samples. Include acceptable scan time and existing sectioning or imaging results to plan validation.
Confirm with the supplierConfirm the X-ray tube, CT/laminography and VoidInspect configuration, then validate resolution, void criteria and radiation dose on samples. Distinguish sample capacity, actual imaging coverage and inspection throughput.
- Public evidence
- The product page documents micro3Dslice laminography, CT, void analysis and semiconductor applications, and describes submicron detail recognition. These supplier descriptions do not establish detection yield or production throughput for a specific package.
Supporting references
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BLNKK organizes information from public sources. A company profile does not imply a documented solution. Applicability still needs confirmation against your samples and engineering conditions.