VADU vacuum solder attachment

PINK GmbH Thermosysteme · Packaging processes and engineering validation

Purpose: Compare melting and evacuation histories against initial die-attach solder voids and wetting.
Technical approach: VADU combines programmable thermal profiles, vacuum and controlled atmosphere; selected formic-acid equipment supports flux-free processing.
Scope of use: PINK lists preforms/pastes and power-semiconductor/module applications; choose batch/inline configurations for the material, carrier and geometry.
Limitations and open questions: These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitations
Vacuum does not guarantee void-free joints. Validate solder quantity, wetting, outgassing and evacuation timing. Formic acid and special heating/residue-management configurations are not universal material recipes.
What to prepare
BLNKK suggests preparing stack/metallization, solder version/quantity, temperature/vacuum records, carrier contact, initial void images and controls.
Confirm with the supplier
Confirm model, carrier/heating, formic-acid options/material compatibility and vacuum controls. Agree on sample-based wetting, void-distribution and residue checks, plus delivered process records.
Public evidence: The official page and brochure describe process controls, modules and options, not this sample’s void results.

Supporting references

Find the company’s contact details and ask about this solution through its official channels.