Aquastorm wet cleaning for package residues

ITW EAE · Packaging processes and engineering validation

Purpose: Debond-residue cleaning needs comparison of chemistry, spraying and drying effects on exposed materials and thin specimens.
Technical approach: Aquastorm 200 combines chemistry-based washing, spray rinsing and drying with flow, pressure and temperature records.
Scope of use: The semiconductor page includes carrier-debond cleaning. Validate the actual adhesive residue, wafer support and spray configuration.
Limitations and open questions: These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitations
Not every residue is removable. Thin-wafer integrity, exposed materials and downstream compatibility need validation; family options are not all standard.
What to prepare
BLNKK suggests original residues, adhesive/thermal history, exposed materials, support arrangements and cleanliness/damage comparison criteria.
Confirm with the supplier
Confirm chemistry, spray/drying configuration, support, concentration-monitoring compatibility and recipe/data records.
Public evidence: The product body describes dual tanks and process control; the market page supplies independent packaging/debond application evidence.

Supporting references

Find the company’s contact details and ask about this solution through its official channels.