Centurion reflow for package ball mounting

ITW EAE · Packaging processes and engineering validation

Purpose: Ball-height and coplanarity differences need comparison with actual ball-reflow temperature histories and support conditions.
Technical approach: Centurion uses forced convection and closed-loop process control, with records of set and actual process values.
Scope of use: The supplier specifically lists ball-mount reflow. Confirm carriers, ball/pad conditions and transport for the selected configuration.
Limitations and open questions: These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitations
Control records are not every ball’s temperature. Solder amount, pads, support and warpage also affect coplanarity.
What to prepare
BLNKK suggests initial ball-height maps, carrier/support drawings, solder conditions and measured profiles, retaining same-location comparisons.
Confirm with the supplier
Confirm heating/cooling, atmosphere, transport/support, traceability data and product-specific profile validation.
Public evidence: The product and semiconductor bodies describe reflow control and ball applications, separating Centurion+ upgrades and other configurations.

Supporting references

Find the company’s contact details and ask about this solution through its official channels.