VisionXP+ vacuum convection reflow comparison

Rehm Thermal Systems GmbH · Packaging processes and engineering validation

Purpose: Bridging investigations require comparisons of actual melting, collapse and cooling histories.
Technical approach: VisionXP+ uses zoned convection heating; an installed vacuum module enables degassing while solder is molten.
Scope of use: Compare assembly reflow conditions with confirmed vacuum, formic-acid and cooling configurations.
Limitations and open questions: These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitations
Zone setpoints are not joint temperatures. Vacuum degassing does not guarantee bridge elimination or qualify a flip-chip assembly.
What to prepare
BLNKK recommends preparing paste, pad spacing, support and placement conditions for temperature, bridge and void comparisons.
Confirm with the supplier
Confirm model, vacuum/atmosphere, thermal/pressure profiles, cooling, monitoring records, sample trials and maintenance.
Public evidence: The official page and November 2025 brochure separate options; a 2025 announcement describes Vac.

Supporting references

Find the company’s contact details and ask about this solution through its official channels.