Phoenix V|tome|x S Neo dual-tube high-resolution industrial CT
Waygate Technologies · Warpage, topography and stress metrology
- Purpose
- Voids or structural anomalies in die attach, solder joints and electronic assemblies can be hidden by surrounding materials. Non-destructive imaging can help localize a region before cross-section or material analysis.
- Technical approach
- V|tome|x S Neo reconstructs 3D CT from X-ray projections with tube and detector configurations selected for the inspection task. A dual-tube configuration offers microfocus and nanofocus options.
- Scope of use
- It is a laboratory inspection option for electronic assemblies and packages, including die attach, hidden solder joints and porosity. Material, geometry and sample scans determine what can actually be resolved.
- Limitations and open questions
These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitationsCT morphology does not directly measure interface adhesion strength; absorption and reconstruction artifacts can affect void interpretation. Confirm dual-tube, metrology and scan coverage against the current equipment configuration.
What to prepareBLNKK suggests preparing attach material, thickness and surrounding stacks, suspected locations and void sizes, plus acceptable scan conditions. Known reference or cross-section data can help evaluate image interpretation.
Confirm with the supplierConfirm the current S Neo model/options, demonstrated sample detectability and image criteria, and the scope of raw projections/reconstructions, analysis software and calibration documentation.
- Public evidence
- The manufacturer’s public information describes electronics inspection and configurable microfocus/nanofocus CT routes for S Neo. Equipment capability does not establish a void-detection guarantee for a particular package.
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BLNKK organizes information from public sources. A company profile does not imply a documented solution. Applicability still needs confirmation against your samples and engineering conditions.