Cloud-based electronics thermo-mechanical and fatigue simulation

SimScale · Thermo-mechanical simulation and lifetime prediction

Purpose: Compare electronic component, module and system temperatures and thermal deformation, including cooling and contact-resistance assumptions.
Technical approach: Browser-based cloud CFD, conjugate heat transfer and structural analysis combine thermal loads, materials and contacts.
Scope of use: For early cooling and thermal-stress comparisons of PCBs, heat sinks, enclosures and assemblies; detailed package models require problem-specific setup.
Limitations and open questions: These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitations
Thermal stress and fatigue life require distinct models and validation. Listed fatigue capability is not a universal package-lifetime model.
What to prepare
BLNKK suggests preparing geometry, power, cooling boundaries, TIM thickness/resistance and measured temperatures; add load cycles and material data for fatigue assessment.
Confirm with the supplier
Confirm current thermomechanical/fatigue methods, parameters and calibration, mesh/contact setup, entitlements and company data-upload policies.
Public evidence: The 2022 datasheet lists thermal stress, shock and thermomechanical fatigue. Current cooling content does not establish calibrated solder-joint lifetime prediction.

Supporting references

Find the company’s contact details and ask about this solution through its official channels.