Celsius Studio thermal-stress and warpage analysis for 3D-IC

Cadence · Thermo-mechanical simulation and lifetime prediction

Purpose: Evaluate temperature, cooling, thermal stress and warpage during die, package and system design to identify risks for further validation.
Technical approach: Combines finite-element and CFD analysis for steady-state/transient thermal behavior and structural stress, with package-design and Integrity 3D-IC integration.
Scope of use: Supports package, PCB, 3D-IC and electronics-cooling studies; available analyses depend on solvers, models and configuration.
Limitations and open questions: These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitations
Results depend on geometry, materials and boundary conditions. Linear-elastic assumptions may miss heating/cooling differences; confirm models for cure shrinkage or viscoelasticity.
What to prepare
Prepare stack-ups, power, temperature-dependent material data, cooling and constraints, plus temperature or warpage measurements for correlation.
Confirm with the supplier
Confirm solver licenses, material and process-stage support, import formats, and validation and convergence checks.
Public evidence: Official material lists thermal, stress, cooling and multistage assembly analysis. A warpage paper compares a temperature-dependent linear-elastic example with published measurements.

Supporting references

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