PI tape development for advanced-packaging grinding and thinning
Taimide · Materials and interfaces
Research candidate · suitability unconfirmed
Official public page; sample suitability remains unconfirmed.
Research checked: 2026-10-18- Purpose
- Tape material options for the wafer grinding/thinning stage.
- Technical approach
- Development of polyimide-based specialty tapes with customer-specific process adoption.
- Scope of use
- Discuss tape configuration and sample trials for grinding/thinning; confirm wafer thickness, size and process window.
- Limitations and open questions
- Scope is limited to grinding/thinning materials. Grade, adhesive stack, volume supply, debond/residue conditions and crack reduction are unconfirmed. This is not a validated end-to-end temporary bonding/debonding system.
- Public evidence
- The official 2025 annual report, PDF pp. 6 and 112 (printed pp. 2 and 108), lists PI specialty tapes for semiconductor grinding/thinning and custom development.
Supporting references
Contact the supplier
Find the company’s contact details and ask about this solution through its official channels.
Potential uses by engineering problem
Edge chipping and cracking after ultrathin-wafer grinding, handling or debonding
Partial match: the documented grinding/thinning tape development is relevant to material comparisons at that stage. Damage reduction for a specific wafer still needs staged inspection and sample validation.
Scope is limited to grinding/thinning materials. Grade, adhesive stack, volume supply, debond/residue conditions and crack reduction are unconfirmed. This is not a validated end-to-end temporary bonding/debonding system.
View engineering problem →BLNKK organizes information from public sources. A company profile does not imply a documented solution. Applicability still needs confirmation against your samples and engineering conditions.