UPILEX-S/SGA polyimide films
UBE · Materials and interfaces
Research candidate · suitability unconfirmed
Official public page; sample suitability remains unconfirmed.
Research checked: 2026-10-18- Purpose
- Electronic-circuit substrates and film selection, subject to the actual layer and grade.
- Technical approach
- Heat-resistant polyimide films: S is the base grade; SGA adds surface treatment for adhesion.
- Scope of use
- Electronic-circuit substrates and film selection, subject to the actual layer and grade.
- Limitations and open questions
- No match to the 60 problems is established. Film dimensional stability and adhesion do not establish low package warpage, a liquid RDL dielectric or a complete temporary-bonding system. The package layer, stack-up and relevant process compatibility remain unconfirmed.
- Public evidence
- UBE’s grade page documents S and SGA applications, surface treatment and material properties.
Supporting references
Contact the supplier
Find the company’s contact details and ask about this solution through its official channels.
BLNKK organizes information from public sources. A company profile does not imply a documented solution. Applicability still needs confirmation against your samples and engineering conditions.