MetalStack · On-chip power-grid aging
NoveetyAI · Simulation and design comparison
Research candidate · suitability unconfirmed
Official public page; sample suitability remains unconfirmed.
Research checked: 2026-10-19- Purpose
- Study on-chip electromigration, thermomigration and IR-drop evolution.
- Technical approach
- Coupled degradation, resistance feedback and temperature-dependent lifetime modeling.
- Scope of use
- Supply the extracted chip grid, material data and thermal field.
- Limitations and open questions
- Do not transfer on-chip wire results to microbumps, copper pillars or solder joints. Package-interconnect geometry, diffusion data and failure criteria require confirmation.
- Public evidence
- Published examples evaluate on-chip grids.
Supporting references
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