Ajinomoto Build-up Film (ABF) for package substrates

Ajinomoto Fine-Techno · Material properties and interface engineering

Purpose: Balance dielectric thickness, fine-line processing and thermo-mechanical properties when selecting package-substrate build-up materials.
Technical approach: Uses an insulating resin film laminated before via and copper-circuit fabrication. Grades offer different low-expansion, high-Tg or low-loss characteristics.
Scope of use: For high-performance semiconductor substrate insulation, including processor and networking applications; select grades for the circuit, via and process requirements.
Limitations and open questions: These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitations
ABF is a material family. Low expansion alone does not guarantee low package warpage; copper, core, stack-up and processing also matter.
What to prepare
Prepare stack-ups, line/space and via dimensions, dielectric targets, lamination and surface-treatment conditions, and reliability/warpage goals.
Confirm with the supplier
Confirm grade data and test conditions, available thicknesses, processing guidance, substrate-maker compatibility and sample supply.
Public evidence: The official page describes thickness control, surface smoothness, processing and grade differences. A technical presentation explains build-up and copper-circuit fabrication.

Supporting references

Find the company’s contact details and ask about this solution through its official channels.