mAgic DA295A low-temperature pressureless silver-sinter die attach
Heraeus Electronics · Material properties and interface engineering
- Purpose
- Power-device die attach must address thermal conduction, electrical conduction and reliability. This pressureless silver-sintering material supports comparing attach materials and process windows.
- Technical approach
- A micro-Ag formulation is dispensed, followed by die placement and pressureless sintering to form a silver joint. The supplier specifies processing at 200°C and above in air or N₂, with the profile adjusted for the application.
- Scope of use
- Named applications include RF power amplifiers, MOSFETs, diodes and thyristors; the factsheet lists Ag/Au-compatible surfaces. Die dimensions, metallization and bondline thickness need stack-specific confirmation.
- Limitations and open questions
These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitationsAg/Au are the published compatible surfaces; other finishes and die sizes need confirmation. The ≥200°C guidance is not a universal drying, dwell or ramp profile, and pressureless processing does not mean stress-free joints.
What to prepareBLNKK recommends preparing die dimensions, backside/substrate finishes, bondline thickness, dispense/dry/sinter histories and thermal/electrical targets. Include void, shear or thermal-cycling reference results to plan validation.
Confirm with the supplierConfirm current material data and availability, size/surface limits and recommended air/N₂ profiles. Discuss storage, open-use conditions, cleaning needs and joint-reliability validation.
- Public evidence
- The product page and factsheet provide pressureless processing, temperature, surface compatibility and sintered thermal/electrical data. These supplier descriptions do not guarantee void-free joints or matching reliability on customer specimens.
Supporting references
Contact the supplier
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BLNKK organizes information from public sources. A company profile does not imply a documented solution. Applicability still needs confirmation against your samples and engineering conditions.