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View contact information ↓Applications: power devices / ceramic substrates / multi-die modules / lead frames · Power-module sintered joints
Silver/copper sintering of dies with different sizes or thicknesses needs die-specific pressure and height control. Tilt, voids and bond-layer condition should be checked alongside the overall press recipe.
Inspect completed sintered joints in power-electronics manufacturing and locate interfaces that need further review. This system inspects joints; it does not produce them.
These candidates are already documented in the engineering problem workflow. Review their conditions, sources and comparison details.
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Italy · Headquarters
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Contacts are listed in the supplier’s public information. Confirm product responsibility and service coverage with the supplier.
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BLNKK organizes information from public sources. A company profile does not imply a documented solution. Applicability still needs confirmation against your samples and engineering conditions.