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Public capability summary

  • VIC-3D full-field 3D deformation and strain measurement · Warpage, topography and stress metrology
  • VIC-Volume internal deformation comparison from CT · Engineering measurement and characterization
Measurement, inspection and failure localizationSimulation, modelling and life predictionReliability validation and failure analysis

Applications: Packages, substrates, material coupons and joints · Board and support coupons

Catalog solutions · 2

Warpage, topography and stress metrology

VIC-3D full-field 3D deformation and strain measurement

Thermal or mechanical loading can produce nonuniform deformation on package surfaces and material coupons. This system measures visible-surface 3D displacement and strain distributions to support deformation comparisons and model validation.

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