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Dai Nippon Printing Co., Ltd.

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Public capability summary

  • Custom vapor chambers and high-frequency copper-foil micro-etch processing.
Package structures and deformation compensationProcess equipment and window control

Other names: DNP · Dai Nippon Printing · 大日本印刷

Applications: Source-to-sink contact/heat-transport comparison · RF conductor-surface/transition comparison

Catalog solutions · 2

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Contact information

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The form is for corporate semiconductor inquiries. The US mailbox and number reach the Electronic Device division; the Japan number is the company switchboard. DNP’s Packaging/Aseptic categories concern general packaging materials and aseptic packaging, so use the semiconductor route for chip packaging. Official source ↗

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BLNKK organizes information from public sources. A company profile does not imply a documented solution. Applicability still needs confirmation against your samples and engineering conditions.