TSA air-to-air thermal shock and interconnect reliability testing
Rapid hot/cold exposure can reveal package and interconnect anomalies associated with thermal mismatch, supporting comparisons of materials and processes.
ESPEC
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View contact information ↓Public capability summary
- Temperature, humidity, thermal shock and accelerated reliability testing
Applications: BGA, CSP, interconnects and power packages · Advanced packaging / automotive electronics / board assemblies · Molded packages / reflow preconditioning · Substrate / PCB insulation reliability · Post-reflow conductor / joint thermal cycling
Catalog solutions · 5
TCC 20 K/min rapid-rate thermal cycling for interconnect fatigue
Repeated temperature cycling can accumulate fatigue in package and board-level joints as materials expand at different rates. Evaluation needs a traceable specimen-temperature history.
LHU constant-climate cabinets for moisture conditioning
New delamination after reflow calls for comparing moisture and drying histories under matched reflow conditions.
AMI biased insulation and leakage monitoring
Leakage during humidity-bias testing requires resistance histories and event timing correlated with environmental conditions.
AMR conductor-resistance tracking during thermal cycling
Post-reflow continuity problems require tracking conductor or joint resistance through thermal cycling.
Candidates in engineering problem guides
These candidates are already documented in the engineering problem workflow. Review their conditions, sources and comparison details.
- AMR conductor-resistance tracking during thermal cycling · Intermittent opens in stacked substrate microvias after reflow →
- LHU constant-climate cabinets for moisture conditioning · New delamination after reflow in moisture-exposed packages →
- AMI biased insulation and leakage monitoring · Substrate insulation leakage under humidity and bias →
- AMI biased insulation and leakage monitoring · Substrate insulation leakage under humidity and bias →
- Assess controlled thermal cycling using measured specimen conditions · Board-level BGA solder-joint fatigue under thermal cycling →
- TSA air-to-air thermal shock and interconnect reliability testing · Board-level BGA solder-joint fatigue under thermal cycling →
- TCC 20 K/min rapid-rate thermal cycling for interconnect fatigue · Board-level BGA solder-joint fatigue under thermal cycling →
Public sources
- Product information: TSA air-to-air thermal shock and interconnect reliability testing
- Technical reference: TSA Series air-to-air thermal shock chambers (PDF)
- Product information: TCC 20 K/min rapid-rate thermal cycling for interconnect fatigue
- Technical reference: Semiconductor reliability test equipment lineup (May 2025) (PDF)
- Public reference: english/products/catalog.html
- Product information: LHU constant-climate cabinets for moisture conditioning
- Product information: AMI biased insulation and leakage monitoring
- Product information: AMR conductor-resistance tracking during thermal cycling
Contact information
Contact the supplier directly through its official channels.
United States · Headquarters · Sales inquiries
ESPEC North America, Inc. — Regional Headquarters
- sales@espec.com
- Phone
- +1 616 896 6100
Official source ↗Source checked
Taiwan · Supplier-listed distributor · Sales inquiries
TAI YU & CO., LTD. — ESPEC Sales and Service
- Phone
- +886 2 2595 3355
Official source ↗Source checked
Mainland China · Supplier office · Sales inquiries
ESPEC Environmental Equipment (Shanghai) Co., Ltd. — Head Office
- lujun@espec.cn
- Phone
- +86 21 5103 6677
Official source ↗Source checked
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