HBM TC BONDER thermocompression bonding
HBM die stacking needs compatible thermocompression equipment and confirmation of force, thermal profiles and materials for the intended joints.
Hanmi Semiconductor
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- HBM thermo-compression bonding · vision placement · packaging equipment
Applications: HBM stacks
Catalog solutions · 1
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South Korea · Headquarters
HANMI Semiconductor — Incheon Head Office
- Phone
- +82 32 571 9100
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South Korea · Supplier office · Technical support
HANMI Semiconductor — AI A/S Center
- Phone
- +82 32 571 1119
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