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Instron

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Public capability summary

  • Three- and four-point bend testing for microelectronic packages · Reliability qualification and failure analysis
  • ElectroPuls E1000 cyclic joint-coupon mechanical comparison · Engineering measurement and characterization
Reliability validation and failure analysisMeasurement, inspection and failure localizationMaterial properties and interface design

Applications: ICs, BGAs, chip-on-film, stacked packages and substrates · Solder-joint and interface coupons · Representative board/support coupons

Catalog solutions · 3

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