Three- and four-point bend testing for microelectronic packages
Measures force-displacement response of thin, multilayer packages under bending to compare strength and cracking/delamination risk.
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View contact information ↓Applications: ICs, BGAs, chip-on-film, stacked packages and substrates · Solder-joint and interface coupons · Representative board/support coupons
Measures force-displacement response of thin, multilayer packages under bending to compare strength and cracking/delamination risk.
Compare joint-coupon cyclic response and damage under consistent mechanical loading.
Board-material and support comparisons need defined, repeatable impact loading.
These candidates are already documented in the engineering problem workflow. Review their conditions, sources and comparison details.
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Taiwan · Supplier office
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Mainland China · Supplier office
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United States · Headquarters
Official source ↗Source checked
Taiwan · Supplier office
Official source ↗Source checked
Mainland China · Supplier office
Official source ↗Source checked
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