Master Bond EP3UF one-component underfill
Compare underfill dispensing and fillet extent against keep-outs, correlating flow, actual gaps and cure history.
Master Bond Inc.
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View contact information ↓Public capability summary
- Develops and manufactures electronic underfills, adhesives and conductive shielding coatings.
Other names: Master Bond · MasterBond
Applications: Microelectronic underfill and fillet/delivery comparison · Electronic shielding structures and ground/opening design
Catalog solutions · 2
Master Bond X5SC conductive shielding coating
Electronic shielding depends on conductive coverage, grounding and circuit clearance.
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Contact information
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For bonding, potting and encapsulation materials, choose Electronics/Microelectronics and describe the product, development stage and operating conditions. The form goes to the US manufacturer’s technical support department. Official source ↗
United States · Headquarters
Master Bond Inc. — Hackensack
- main@masterbond.com
- Phone
- +1 201 720 6117
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