IC Packaging Warp simulation for molding, cure and cooldown
Molding, curing and cooling create shrinkage and stress changes that affect package warpage. IC Packaging Warp supports comparisons of material and process conditions.
Moldex3D
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View contact information ↓Public capability summary
- IC Packaging Warp simulation for molding, cure and cooldown · Thermo-mechanical simulation and lifetime prediction
- Moldex3D reactive-material characterization service · Engineering measurement and characterization
Applications: Transfer/compression molding, FOWLP and molded underfill · Actual EMC/reactive resin
Catalog solutions · 2
Moldex3D reactive-material characterization service
Obtain reactive material data for incomplete-fill and molding-flow assessments.
Candidates in engineering problem guides
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- IC Packaging Warp simulation for molding, cure and cooldown · Warpage reversal during cooling in large 2.5D FCBGA packages →
- IC Packaging simulation · Post-mold die shift and RDL misalignment in fan-out packages →
- Moldex3D reactive-material characterization service · Incomplete mold filling and short shots →
Public sources
Contact information
Contact the supplier directly through its official channels.
Moldex3D is the software and services brand of CoreTech System. The form includes IC Packaging and Material Characterization. The U.S. sales.us mailbox is a sales contact; the reviewed mainland office listing does not publish an email address. Official source ↗
United States · Supplier office · Sales inquiries
Moldex3D — North America Office, Farmington Hills
- Phone
- +1 248 946 4570
Official source ↗Source checked
Taiwan · Headquarters
CoreTech System Co., Ltd. (Moldex3D) — Hsinchu Headquarters
- mail@moldex3d.com
- Phone
- +886 3 560 0199
Official source ↗Source checked
Mainland China · Supplier office
Moldex3D — Suzhou Office
- Phone
- +86 512 6288 7663
Official source ↗Source checked
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BLNKK organizes information from public sources. A company profile does not imply a documented solution. Applicability still needs confirmation against your samples and engineering conditions.