Marc nonlinear thermo-mechanical and interface-contact simulation
Compare stack and process factors when package warpage involves nonlinear materials or interface contact.
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View contact information ↓Other names: MSC Software, now part of Cadence
Applications: Package stacks, interfaces, solder joints and materials · Filled-polymer research
Compare stack and process factors when package warpage involves nonlinear materials or interface contact.
Develop effective multiphase-material inputs that separate constituent and microstructure effects in package models.
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MSC Software is now part of Cadence. Use the CAE expert form for Marc, Digimat and related inquiries; the listed phone is the Cadence US corporate switchboard. Official source ↗
United States · Headquarters
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