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Unclaimed company profile based on public research. Supplier endorsement and project-level performance are unconfirmed.

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Process equipment

HAD812 IC-frame die bonder

Potential engineering use: [Initial die-attach voids and coverage] Compare initial coverage and voids in solder/conductive-adhesive die attach.

Research candidate · suitability unconfirmed

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Research checked: 2026-10-15

Potential uses by engineering problem

Initial die-attach voids and incomplete coverage

Compare initial coverage and voids in solder/conductive-adhesive die attach.

Restrict to the layer below the die; silver-sinter pores and upper copper clips are separate problems.

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