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Mitsubishi Gas Chemical

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Materials and interfaces

BT laminate for IC packages

Potential engineering use: [Cooling-stage warpage reversal in large 2.5D FCBGA] Compare material, stack and thermal-history effects on cooling curvature.

Research candidate · suitability unconfirmed

Official public page; sample suitability remains unconfirmed.

Research checked: 2026-10-15

Potential uses by engineering problem

Warpage reversal during cooling in large 2.5D FCBGA packages

Compare material, stack and thermal-history effects on cooling curvature.

Require heating/cooling data, cure shrinkage and viscoelastic properties; room-temperature flatness does not establish reversal behavior.

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