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Dymax

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Materials and interfaces

9001-E-V3.1 low-stress wire-bond encapsulant

Potential engineering use: [Power-wirebond lift and heel fatigue] Investigate bond location, interface quality and stress control.

Research candidate · suitability unconfirmed

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Research checked: 2026-10-15

Potential uses by engineering problem

Power wire-bond lift-off and heel fatigue

Investigate bond location, interface quality and stress control.

Visual inspection or encapsulants provide partial support; qualify power-wire geometry and cycling life separately.

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