UC5000 panel-level packaging bonder
Evaluate die placement, alignment and bonding choices for panel-level chiplet assembly using a configurable UC5000 platform.
Toray Engineering
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View contact information ↓Public capability summary
- Flip-chip bonders · inspection · coating and semiconductor assembly
Applications: Chiplets and panel-level packaging · Glass-panel interposer RDL
Catalog solutions · 2
TRENG-PLP glass-panel coating and cure
Compare glass-panel RDL film thickness and handling conditions for warped substrates.
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Public sources
Contact information
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For bonding, coating and packaging equipment, select Display / Semiconductor manufacturing equipment in the form. Listed phones provide company routing; the contact directory routes measurement software and inspection equipment separately. Official source ↗
Taiwan · Supplier office
Toray Engineering Co., Ltd. — Taiwan Branch / Taipei Routing
- Phone
- +886 2 2547 1000
Official source ↗Source checked
Mainland China · Supplier office
Toray Engineering (Shanghai) Co., Ltd. — Company Routing
- Phone
- +86 21 5241 7700
Official source ↗Source checked
Japan · Headquarters
Toray Engineering Co., Ltd. — Tokyo Headquarters / General Routing
- Phone
- +81 3 3241 1541
Official source ↗Source checked
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