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Toray Industries

Explore the supplier’s public information and its documented technical solutions.

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Public capability summary

  • Polyimides · films · carbon and thermal materials for electronics
Material properties and interface design

Applications: RDL and buffer dielectric layers · Electronic dissimilar-material bonding / lamination

Catalog solutions · 2

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Contact information

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The electronic-materials form includes PHOTONEECE, SEMICOFINE and FALDA. For mold-release films, use the Film division link in the semiconductor contact directory. Taiwan and US phones provide general group routing rather than dedicated electronic-materials sales. Official source ↗

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BLNKK organizes information from public sources. A company profile does not imply a documented solution. Applicability still needs confirmation against your samples and engineering conditions.