PHOTONEECE photodefinable polyimide
Compare photodefinable dielectric options for RDL insulation and die-surface protection within the PHOTONEECE polyimide family.
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View contact information ↓Applications: RDL and buffer dielectric layers · Electronic dissimilar-material bonding / lamination
Compare photodefinable dielectric options for RDL insulation and die-surface protection within the PHOTONEECE polyimide family.
Evaluate bondline thickness and stress relaxation when joining materials with different thermal expansion.
These candidates are already documented in the engineering problem workflow. Review their conditions, sources and comparison details.
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The electronic-materials form includes PHOTONEECE, SEMICOFINE and FALDA. For mold-release films, use the Film division link in the semiconductor contact directory. Taiwan and US phones provide general group routing rather than dedicated electronic-materials sales. Official source ↗
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