FCBGA multilayer package substrates
Plan die connections, substrate routing and board interfaces together when evaluating multilayer FCBGA substrate manufacturing.
Unimicron Technology
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View contact information ↓Public capability summary
- IC substrates · advanced interconnect and high-density packaging
Applications: FCBGA, 2.5D and chiplets
Catalog solutions · 1
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Contact information
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Contact CarrierSALES for IC substrates and the regional PCB team for PCB, HDI or rigid-flex inquiries. The online form serves Unimicron Germany PCB sales; it is not a general form for Taiwan or China IC substrate inquiries. Official source ↗
Taiwan · Supplier office · Sales inquiries
Unimicron Technology — Shanying / IC Substrate Sales
- Phone
- +886 3 350 0386
Official source ↗Source checked
Mainland China · Supplier office · Sales inquiries
Unimicron Group — Suzhou Qunce Technology / IC Substrate Sales
- Phone
- +86 512 6299 6168
Official source ↗Source checked
Taiwan · Supplier office · Sales inquiries
Unimicron Technology — Shanying / PCB, HDI and Rigid-Flex Sales
- Phone
- +886 3 350 0386
Official source ↗Source checked
More regional contacts (2)
Mainland China · Supplier office · Sales inquiries
Unimicron Group — Kunshan Dingxin Electronics / PCB and HDI Sales
- Phone
- +86 512 5779 9168
Official source ↗Source checked
Germany · General contact · Sales inquiries
Unimicron Germany GmbH — PCB Sales Inquiry Routing
- info@unimicron.de
- Phone
- +49 2831 394 0
Official source ↗Source checked
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