IR and test-path validity
First add paths, baselines, polarity, and confounding checks.
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Compare each solution's purpose, inputs and limits.
For “Substrate insulation leakage under humidity and bias”, check what each solution can answer before planning validation.
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BLNKK assessment notes
Update engineering conditions →Your next step
Compare purposes and limits now. Confirm key sample conditions before planning validation.
0 solutions selected0 of 5 relevant conditions confirmedNo solutions selected; these notes cover the current engineering problem.
Priority items to confirm · 5
01An insulation path between substrate conductors has been localizedUnconfirmed
Has low IR or leakage been localized between adjacent conductors in an organic substrate?
First confirm continuity within the same net and rule out an open in a single via chain; record IR paths separately from conduction resistance.
Update engineering conditions →02Environmental, bias, and IR baselines are comparableUnconfirmed
Are initial IR, humidity and temperature, applied bias, and measurement polarity traceable?
Retain unbiased damp-heat exposure and biased stages separately; do not combine different polarities or measurement times into one trend.
Update engineering conditions →03Fixture, surface, and condensation controls are traceableUnconfirmed
Have wiring and fixture leakage, surface contamination, and condensation been checked independently?
Low IR at wiring locations can invalidate a coupon; leakage curves alone cannot distinguish surface dendrites from internal CAF.
Update engineering conditions →04Actual geometry and material histories are comparableUnconfirmed
Have conductor spacing, layer positions, glass-fiber orientation, and material / manufacturing histories been aligned?
Use actual geometric spacing; recommendations for the 7628 material family cannot serve as a shared threshold for all substrates.
Update engineering conditions →05Targeted failed and normal samples are traceableUnconfirmed
Are targeted samples available with retained failure electrical time histories, without prior cleaning or excessive electrical testing?
First record surfaces and failure locations; CAF filaments are easily damaged, and their absence in a cross-section does not rule them out.
Update engineering conditions →Relevant assessment paths
Localize failure paths and morphology
First retain electrical time histories, unaltered samples, and normal controls.
Controlled material / spacing comparisons
First add shared environmental conditions, confounding controls, and actual structures.
Assessment preparation checklist
Discussion preparation based on the relevant engineering conditions; not mandatory supplier requirements or a record of evidence already available.
- An insulation path between substrate conductors has been localized
- Environmental, bias, and IR baselines are comparable
- Fixture, surface, and condensation controls are traceable
- Actual geometry and material histories are comparable
1 more preparation item
- Targeted failed and normal samples are traceable
Check the comparison table above for each solution’s specific inputs and applicability limits.
Questions to discuss
- Are IR measurements, bias polarity, environmental conditions, and baselines traceable?
- Is leakage located at the wiring, on the surface, or internally between conductors?
- How are layer positions, actual spacing, glass-fiber orientation, and manufacturing histories aligned?
Public references · 12
- IPC · IPC-TM-650 2.6.25 Revision B: CAF Resistance Test X-Y Axis ↗
View source notes and limits
The method requires traceable bias and measurement polarity, humidity, and initial IR, and distinguishes wiring leakage, condensation, and surface failures; filaments are easily damaged.
A PWB coupon method from 2016 Rev B; substrate geometry and current applicable specifications require separate confirmation. No universal duration, voltage, or failure threshold is provided.
- Isola · Use of 7628 Glass in Lead Free & CAF Applications ↗
View source notes and limits
Application guidance for a specific material family connects glass-fiber wetting, weave, and spacing with CAF risk, and requires customers to perform full validation.
Experience from 2016 with 7628 and FR408 / IS415 / FR408HR / I-Speed; do not extrapolate material-family or spacing thresholds to all substrates.
- ASE · Failure Analysis Lab ↗
View source notes and limits
Lists capabilities for electrical failure localization, nondestructive X-ray inspection, and targeted cross-section / FIB analysis.
The service list does not guarantee detection rates at every RDL or microvia scale; sampling, structures, and destructive risks require confirmation.
- ESPEC · AMI biased insulation and leakage monitoring ↗
View source notes and limits
ESPEC’s product/service pages and June 2021 catalogue describe resistance measurements, event detection and chamber linkage across voltage configurations.
Scope and limitations Resistance drops do not distinguish CAF, surface dendrites or fixture leakage without localization. Event detection is not continuous precision waveform capture; chambers and fixtures require compatible configurations. What to prepare BLNKK suggests documenting spacing, stack-up, bias, climate and failure thresholds, with fixture blanks and failed-site analysis. Confirm with the supplier Confirm bias/resistance ranges, event thresholds, recording, chamber/fixture compatibility, options and calibration.
- Oneida Research Services · ORS controlled SIR and ECM testing ↗
View source notes and limits
The page lists time, temperature, humidity, bias, IPC coupons and methods.
Scope and limitations Surface SIR/ECM does not qualify internal CAF or directly predict field life. Confirm representative substrate paths and failure locations separately. What to prepare BLNKK suggests documenting materials, residues/cleaning, spacing and paths, with background-leakage/process controls and failure-localization records. Confirm with the supplier Confirm coupons, bias/environment/duration, methods and acceptance criteria, plus any separate testing needed for suspected internal CAF.
- TAIYO INK MFG. CO., LTD. · Taiyo Ink Zaristo125G build-up dielectric film ↗
View source notes and limits
The Japanese product page documents 125G and its lamination, curing, laser-drilling and copper-deposition process.
Scope and limitations The public material does not establish CAF qualification for a specific stack or a drop-in ABF replacement. Material selection does not locate or repair existing leakage. What to prepare BLNKK suggests preparing stack details, conductor/via spacing and moisture-bias history, with matched candidate-film and control coupons. Confirm with the supplier Confirm board and packaging uses, lamination/cure windows, roughening and plating compatibility, and insulation-reliability evidence under relevant conditions.
- TAIYO INK MFG. CO., LTD. · Taiyo Ink THP-100 permanent hole-plugging compound ↗
View source notes and limits
The Japanese technical page names DX1/Z2 and describes their permanent plugging process.
Scope and limitations Package-board use does not establish project-specific CAF or insulation qualification. Plugging neither plates copper nor repairs leakage, and grade-specific processes are not interchangeable. What to prepare BLNKK suggests preparing hole/plating geometry, spacing, process history and cross-sections for matched moisture-bias and fill-quality comparisons. Confirm with the supplier Confirm DX1/Z2 selection, hole-wall and subsequent-process compatibility, cure/buffing windows, and appropriate void, shrinkage and insulation assessments.
- Maschinenfabrik LAUFFER GmbH & Co. KG · RMV vacuum lamination for organic substrates ↗
View source notes and limits
The current page and L011 brochure describe modular RMV configurations, without substrate-specific CAF or leakage validation.
Scope and limitations A press does not establish CAF resistance. Portfolio-wide ratings, start/transfer modes and data-management features are not automatically available on every RMV. What to prepare BLNKK suggests preparing resin/glass/copper stacks, dimensions, lamination/storage history, failed/control samples and available leakage, bias and humidity data. Confirm with the supplier Confirm configuration, material compatibility, vacuum/temperature/pressure and cooling/transfer procedures. Agree on available process records and separate CAF/insulation testing and acceptance criteria.
- Isola USA Corp. · Isola 370HR glass/epoxy laminates ↗
View source notes and limits
Isola lists CAF resistance and typical properties, not validation at your spacing and bias/humidity conditions.
Scope and limitations Supplier CAF resistance is not board-specific qualification or a guarantee against filament growth. Typical properties and general material approvals do not qualify your spacing/stack/cycles. What to prepare BLNKK suggests preparing glass/resin/copper details, lamination/drilling/reflow history, spacing and failure locations. Retain absorption, bias/humidity and insulation controls with traceable coupons. Confirm with the supplier Confirm construction, current specifications and available CAF-test conditions/results. Agree on spacing, fabrication, preconditioning and biased-humidity validation; separate material specifications from board acceptance.
- GEN3 Systems Limited · AutoCAF2+ substrate CAF resistance testing ↗
View source notes and limits
The current whole-system page documents CAF monitoring.
Scope and limitations Resistance loss alone neither proves nor locates CAF. Fixture leakage, surface contamination and condensation need controls and physical analysis. What to prepare BLNKK suggests coupon structures, conductor spacing, bias/environment histories, blank/baseline controls and stopping criteria. Confirm with the supplier Confirm ranges, bias, shielding/background, sampling intervals and rack/chamber compatibility.
- GEN3 Systems Limited · CM extractable ionic-residue measurement ↗
View source notes and limits
The current CM page documents conductivity and extraction conditions.
Scope and limitations It does not identify individual ions or buried CAF. PICT is not total residue content; excessive extraction can change results. What to prepare BLNKK suggests cleaning history, surface-area calculation, material compatibility, blanks and controls with a fixed procedure. Confirm with the supplier Confirm ROSE/PICT selection, liquid/temperature controls, area/volume, calibration and duration criteria.
- iST - Integrated Service Technology · HAST moisture-acceleration reliability validation and anomaly analysis ↗
View source notes and limits
iST’s 2022 HAST/ECM article explains package pitch, residue and environment effects, and describes planning, hardware assessment, testing and anomaly-analysis support. Its 2024 burn-in-board article adds board/socket and HAST/THB context.
Scope and limitations HAST results do not establish every thermo-mechanical life mechanism or a field-use lifetime. Board contamination, flux residue and power anomalies can confound results and require investigation. What to prepare BLNKK suggests preparing package/pitch details, circuit and bias needs, objectives, sample information and preconditioning/cleaning records. For existing failures, include electrical changes, event timing, board details and images to help plan analysis. Confirm with the supplier Ask iST to confirm the test, temperature/humidity, bias, duration, sample count, fixture compatibility and failure criteria. Agree on power monitoring, records and failure-analysis deliverables; do not infer field life directly from test conditions.
Full assessment recordExpand for all conditions, path rules and original assessment notes.
Current assessment and next steps
Based on reported conditions and public sources. Ready to assess does not establish sample applicability or root cause. Order does not identify the best solution.
Known conditions · 0
Key unknowns · 5
- Has low IR or leakage been localized between adjacent conductors in an organic substrate?First confirm continuity within the same net and rule out an open in a single via chain; record IR paths separately from conduction resistance.
- Are initial IR, humidity and temperature, applied bias, and measurement polarity traceable?Retain unbiased damp-heat exposure and biased stages separately; do not combine different polarities or measurement times into one trend.
- Have wiring and fixture leakage, surface contamination, and condensation been checked independently?Low IR at wiring locations can invalidate a coupon; leakage curves alone cannot distinguish surface dendrites from internal CAF.
- Have conductor spacing, layer positions, glass-fiber orientation, and material / manufacturing histories been aligned?Use actual geometric spacing; recommendations for the 7628 material family cannot serve as a shared threshold for all substrates.
- Are targeted samples available with retained failure electrical time histories, without prior cleaning or excessive electrical testing?First record surfaces and failure locations; CAF filaments are easily damaged, and their absence in a cross-section does not rule them out.
Paths to assess
IR and test-path validity
First add paths, baselines, polarity, and confounding checks.
- Has low IR or leakage been localized between adjacent conductors in an organic substrate?
- Are initial IR, humidity and temperature, applied bias, and measurement polarity traceable?
- Have wiring and fixture leakage, surface contamination, and condensation been checked independently?
Conditions that change this path
- Has low IR or leakage been localized between adjacent conductors in an organic substrate?Supports assessment: An insulation path between substrate conductors has been localized · Unsuitable for now: Interrupted conduction within the same net has been localized
- Are initial IR, humidity and temperature, applied bias, and measurement polarity traceable?Supports assessment: Environmental, bias, and IR baselines are comparable · Unsuitable for now: Baselines, polarity, or environmental histories are insufficient
- Have wiring and fixture leakage, surface contamination, and condensation been checked independently?Supports assessment: Fixture, surface, and condensation controls are traceable · Unsuitable for now: Fixture, surface, or condensation confounding remains
Localize failure paths and morphology
First retain electrical time histories, unaltered samples, and normal controls.
- Has low IR or leakage been localized between adjacent conductors in an organic substrate?
- Are targeted samples available with retained failure electrical time histories, without prior cleaning or excessive electrical testing?
Conditions that change this path
- Has low IR or leakage been localized between adjacent conductors in an organic substrate?Supports assessment: An insulation path between substrate conductors has been localized · Unsuitable for now: Interrupted conduction within the same net has been localized
- Are targeted samples available with retained failure electrical time histories, without prior cleaning or excessive electrical testing?Supports assessment: Targeted failed and normal samples are traceable · Unsuitable for now: Failed samples have been altered and original evidence is unavailable
Controlled material / spacing comparisons
First add shared environmental conditions, confounding controls, and actual structures.
- Has low IR or leakage been localized between adjacent conductors in an organic substrate?
- Are initial IR, humidity and temperature, applied bias, and measurement polarity traceable?
- Have wiring and fixture leakage, surface contamination, and condensation been checked independently?
- Have conductor spacing, layer positions, glass-fiber orientation, and material / manufacturing histories been aligned?
Conditions that change this path
- Has low IR or leakage been localized between adjacent conductors in an organic substrate?Supports assessment: An insulation path between substrate conductors has been localized · Unsuitable for now: Interrupted conduction within the same net has been localized
- Are initial IR, humidity and temperature, applied bias, and measurement polarity traceable?Supports assessment: Environmental, bias, and IR baselines are comparable · Unsuitable for now: Baselines, polarity, or environmental histories are insufficient
- Have wiring and fixture leakage, surface contamination, and condensation been checked independently?Supports assessment: Fixture, surface, and condensation controls are traceable · Unsuitable for now: Fixture, surface, or condensation confounding remains
- Have conductor spacing, layer positions, glass-fiber orientation, and material / manufacturing histories been aligned?Supports assessment: Actual geometry and material histories are comparable · Unsuitable for now: Only nominal spacing or generic material descriptions are available
What to do next
No result provided. Clarify key conditions before arranging an assessment.
- Has low IR or leakage been localized between adjacent conductors in an organic substrate?
What to prepare
- Initial and biased IR time histories; Environmental and polarity records; Wiring, surface, and condensation checks
- Original IR time histories and paths; Unaltered normal and anomalous samples; Surface and interconductor locations
- Valid and comparable IR results; Actual layer positions, spacing, and weave; Material and manufacturing histories from the same batch
- Contactable boards, substrates and insulation coupons for electrochemical-migration and humidity-bias studies, using specimen-compatible bias and fixtures.
- The service addresses PCB process cleanliness, flux residues and solder-mask SIR/ECM evaluations.
- Consider it for build-up board dielectric evaluation; confirm packaging use and compatibility with the actual stack.
- The official page distinguishes DX for package boards and Z for general multilayer boards; match the grade to the hole structure.
- LAUFFER lists PCB, CCL and IC-substrate applications; confirm RMV format, stack and process window.
- Confirm board/process compatibility; multilayer-PWB use does not establish applicability to every ABF/RDL package stack.
- It supports CAF studies of multilayer-board materials/processes. Match coupons, wiring, racks and chamber interfaces to the configuration.
- Match compatible boards/components, specimen dimensions, area, liquid volume and procedure to the model/method.
- Fits evaluations of moisture resistance and test anomalies in IC packages such as BGA and CSP. Agree on temperature/humidity, bias, duration, samples and preconditioning with the laboratory for the product and qualification objective. Bias net/polarity and HAST history Cleanliness, fixture blank and leakage path
Questions to discuss
- Are IR measurements, bias polarity, environmental conditions, and baselines traceable?
- Is leakage located at the wiring, on the surface, or internally between conductors?
- How are layer positions, actual spacing, glass-fiber orientation, and manufacturing histories aligned?
Public references
IPC · IPC-TM-650 2.6.25 Revision B: CAF Resistance Test X-Y Axis ↗A PWB coupon method from 2016 Rev B; substrate geometry and current applicable specifications require separate confirmation. No universal duration, voltage, or failure threshold is provided.
Isola · Use of 7628 Glass in Lead Free & CAF Applications ↗Experience from 2016 with 7628 and FR408 / IS415 / FR408HR / I-Speed; do not extrapolate material-family or spacing thresholds to all substrates.
ASE · Failure Analysis Lab ↗The service list does not guarantee detection rates at every RDL or microvia scale; sampling, structures, and destructive risks require confirmation.
ESPEC · AMI biased insulation and leakage monitoring ↗Scope and limitations Resistance drops do not distinguish CAF, surface dendrites or fixture leakage without localization. Event detection is not continuous precision waveform capture; chambers and fixtures require compatible configurations. What to prepare BLNKK suggests documenting spacing, stack-up, bias, climate and failure thresholds, with fixture blanks and failed-site analysis. Confirm with the supplier Confirm bias/resistance ranges, event thresholds, recording, chamber/fixture compatibility, options and calibration.
Oneida Research Services · ORS controlled SIR and ECM testing ↗Scope and limitations Surface SIR/ECM does not qualify internal CAF or directly predict field life. Confirm representative substrate paths and failure locations separately. What to prepare BLNKK suggests documenting materials, residues/cleaning, spacing and paths, with background-leakage/process controls and failure-localization records. Confirm with the supplier Confirm coupons, bias/environment/duration, methods and acceptance criteria, plus any separate testing needed for suspected internal CAF.
TAIYO INK MFG. CO., LTD. · Taiyo Ink Zaristo125G build-up dielectric film ↗Scope and limitations The public material does not establish CAF qualification for a specific stack or a drop-in ABF replacement. Material selection does not locate or repair existing leakage. What to prepare BLNKK suggests preparing stack details, conductor/via spacing and moisture-bias history, with matched candidate-film and control coupons. Confirm with the supplier Confirm board and packaging uses, lamination/cure windows, roughening and plating compatibility, and insulation-reliability evidence under relevant conditions.
TAIYO INK MFG. CO., LTD. · Taiyo Ink THP-100 permanent hole-plugging compound ↗Scope and limitations Package-board use does not establish project-specific CAF or insulation qualification. Plugging neither plates copper nor repairs leakage, and grade-specific processes are not interchangeable. What to prepare BLNKK suggests preparing hole/plating geometry, spacing, process history and cross-sections for matched moisture-bias and fill-quality comparisons. Confirm with the supplier Confirm DX1/Z2 selection, hole-wall and subsequent-process compatibility, cure/buffing windows, and appropriate void, shrinkage and insulation assessments.
Maschinenfabrik LAUFFER GmbH & Co. KG · RMV vacuum lamination for organic substrates ↗Scope and limitations A press does not establish CAF resistance. Portfolio-wide ratings, start/transfer modes and data-management features are not automatically available on every RMV. What to prepare BLNKK suggests preparing resin/glass/copper stacks, dimensions, lamination/storage history, failed/control samples and available leakage, bias and humidity data. Confirm with the supplier Confirm configuration, material compatibility, vacuum/temperature/pressure and cooling/transfer procedures. Agree on available process records and separate CAF/insulation testing and acceptance criteria.
Isola USA Corp. · Isola 370HR glass/epoxy laminates ↗Scope and limitations Supplier CAF resistance is not board-specific qualification or a guarantee against filament growth. Typical properties and general material approvals do not qualify your spacing/stack/cycles. What to prepare BLNKK suggests preparing glass/resin/copper details, lamination/drilling/reflow history, spacing and failure locations. Retain absorption, bias/humidity and insulation controls with traceable coupons. Confirm with the supplier Confirm construction, current specifications and available CAF-test conditions/results. Agree on spacing, fabrication, preconditioning and biased-humidity validation; separate material specifications from board acceptance.
GEN3 Systems Limited · AutoCAF2+ substrate CAF resistance testing ↗Scope and limitations Resistance loss alone neither proves nor locates CAF. Fixture leakage, surface contamination and condensation need controls and physical analysis. What to prepare BLNKK suggests coupon structures, conductor spacing, bias/environment histories, blank/baseline controls and stopping criteria. Confirm with the supplier Confirm ranges, bias, shielding/background, sampling intervals and rack/chamber compatibility.
GEN3 Systems Limited · CM extractable ionic-residue measurement ↗Scope and limitations It does not identify individual ions or buried CAF. PICT is not total residue content; excessive extraction can change results. What to prepare BLNKK suggests cleaning history, surface-area calculation, material compatibility, blanks and controls with a fixed procedure. Confirm with the supplier Confirm ROSE/PICT selection, liquid/temperature controls, area/volume, calibration and duration criteria.
iST - Integrated Service Technology · HAST moisture-acceleration reliability validation and anomaly analysis ↗Scope and limitations HAST results do not establish every thermo-mechanical life mechanism or a field-use lifetime. Board contamination, flux residue and power anomalies can confound results and require investigation. What to prepare BLNKK suggests preparing package/pitch details, circuit and bias needs, objectives, sample information and preconditioning/cleaning records. For existing failures, include electrical changes, event timing, board details and images to help plan analysis. Confirm with the supplier Ask iST to confirm the test, temperature/humidity, bias, duration, sample count, fixture compatibility and failure criteria. Agree on power monitoring, records and failure-analysis deliverables; do not infer field life directly from test conditions.