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Engineering problems3
Mould / moulding flow path / resin-exclusion area
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15
New delamination after reflow in moisture-exposed packages
Confirm new reflow damage and interface depth, then compare exposure / drying under common thermal loads. Do not assume all delamination is moisture-driven.
Mold resin / die / substrate interfaces · Moisture exposure, drying controls, and reflow
First locate macroscopic short shots and flow fronts at demolding, then align actual resin-delivery, temperature and pressure histories. Prepare comparisons using sample-specific cavities, gate/vent geometry and material boundary conditions. Internal voids or later delamination do not establish the cause of incomplete filling.
Mold cavity and molding flow paths around dies · Inspection after transfer/compression molding and demolding
First align parting/sealing-surface flash and resin keep-out contamination with mold contact and actual clamping/cavity pressure. Then separate sealing geometry from resin flow. Underfill fillets or panel-handling issues cannot substitute for sealing-window evidence.
Mold parting/sealing surfaces and resin keep-out zones · Molding clamping and demolding inspection
Know the problem scope? Explore six technology directions
Technology directions help you explore methods. They do not establish a standard solution or sample suitability.
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Explore technical paths and candidates related to an engineering problem. Compare intended uses, applicability and sources, identify missing information and key questions, and download an assessment preparation summary. These outputs help you prepare your next technical assessment. Applicability still requires samples, measurements and supplier confirmation.
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The supplier catalog is compiled from public sources. Problem-specific candidates include context for the problem, structure and stage. A listing or candidate does not establish verified applicability, supplier endorsement or a purchasing recommendation. Read the sources and limitations together, then confirm your conditions with the supplier.
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