Your solution map
New delamination after reflow in moisture-exposed packages
Check BLNKK's understanding of the problem, then review priority paths, candidate solutions and missing conditions.
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Your solution map
Check the problem definition, then choose which solutions to explore.
3 priority paths13 candidate solutions14 sources
BLNKK's current understanding
Please check the details- Structure / bonding interface
- Mold resin / die / substrate interfaces
- Observation stage
- Moisture exposure, drying controls, and reflow
- Phenomenon to localize
- New post-reflow delamination or package cracks
- Engineering decision
- Use moisture / storage histories and pre- / post-reflow controls to select drying, material-interface, or preconditioning tests
- Sample evidence still required
- Can same-interface pre- / post-reflow maps and normal samples be provided?
Paths to assess first
Paths serve different purposes and can be combined01
Pre- / post-reflow interface localizationConfirm new damage and delamination depth
First02
Moisture / drying and reflow-preconditioning controlsCompare exposure histories under fixed thermal loads
First03
Mold materials and adhesion-interface reviewSeparate material / surface and handling hypotheses
FirstCurrent candidate solutions
Sample suitability still needs confirmationSAT and targeted-section interface-analysis evaluationASE · Can help answer: Public capabilities support targeted sectioning after nondestructive localization.
→Device-compatible drying / preconditioning controlsBLNKK engineering review request (provider unconfirmed) · Can help answer: Define sample trials from public handling and comparison workflows.
→Mold-adhesion / material review after drying controlsBLNKK engineering review request (provider unconfirmed) · Can help answer: Comparable moisture tests and mold-interface evidence are both needed before material / surface comparisons.
→Next: confirm engineering conditionsUse 5 key conditions to adjust the assessment order, then choose solutions to compare.
Check engineering conditions →