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Current problem: New delamination after reflow in moisture-exposed packagesBack to this problem’s solution map →
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Technical Q&ABLNKK editorial notes

New reflow delamination after package moisture uptake: How should the next controls be designed?

Retain same-interface pre- / post-reflow maps and exposure history, then confirm device-compatible drying controls.

Moisture absorptionDelaminationReflow

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  • Can same-interface pre- / post-reflow maps and normal samples be provided?
  • What are part-specific MSL, bag-opening exposure, drying, and measured reflow profiles?
  • Is delamination at mold, die attach, or underfill, and what is subsequent reliability?
Technical Q&A awaiting input
  • Can same-interface pre- / post-reflow maps and normal samples be provided?
  • What are part-specific MSL, bag-opening exposure, drying, and measured reflow profiles?
  • Is delamination at mold, die attach, or underfill, and what is subsequent reliability?

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