Problem context and interpretation
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- Can same-interface pre- / post-reflow maps and normal samples be provided?
- What are part-specific MSL, bag-opening exposure, drying, and measured reflow profiles?
- Is delamination at mold, die attach, or underfill, and what is subsequent reliability?
Technical Q&A awaiting input- Can same-interface pre- / post-reflow maps and normal samples be provided?
- What are part-specific MSL, bag-opening exposure, drying, and measured reflow profiles?
- Is delamination at mold, die attach, or underfill, and what is subsequent reliability?
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