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Current problemLeakage localization in TSV insulating liners
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Leakage localization in TSV insulating liners

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BLNKK's current understanding

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Structure / bonding interface
Insulating liner between TSV copper and silicon
Observation stage
Via formation, after liner deposition or copper filling, and bias verification
Phenomenon to localize
TSV-to-substrate leakage or dielectric breakdown
Engineering decision
Use vertical-interconnect-to-substrate insulation measurements to guide liner-integrity assessment or contamination sampling
Sample evidence still required
How do electrode area, TSV count or density, and substrate doping affect the aggregate measurement?
Next: confirm engineering conditionsUse 5 key conditions to adjust the assessment order, then choose solutions to compare.
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