How can ceramic through-thickness conduction, copper spreading and contact-interface contributions be separated before comparing ceramic types, thicknesses and metallization stacks?
Provide ceramic/copper thicknesses, heat-source locations and fixed thermal boundaries to compare whether substrate-stack changes produce distinguishable thermal-path differences.
How can ceramic through-thickness conduction, copper spreading and contact-interface contributions be separated before comparing ceramic types, thicknesses and metallization stacks?
Measure temperature rise and thermal paths at fixed power, heat-source geometry and contact/cooling boundaries
Use a layered model to check sensitivity and identifiability of ceramic through-thickness conduction and copper spreading
Compare material/thickness candidates at the same boundaries, while checking insulation and thermomechanical limits
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