How can intermittent fine-line RDL opens after thermal cycling be localized?

Provide verifiable electrical, location, and stackup data before comparing physical-analysis and modeling approaches.

RDLThermal cyclingFailure analysisThermomechanical simulation

Problem context and interpretation

BLNKK review of public information

This issue separates failure localization from thermomechanical analysis; simulated high stress does not replace crack evidence.

In-cycle resistance / continuity and temperature timeline
Netlists, RDL layouts, layer thicknesses, and anomaly locations
Material curves, package boundaries, and good-sample controls

Reference sourcesASE：Fine-Line RDL Structure Analysis of Fan-Out Chip-on-Substrate Platform ↗

Technical Q&A awaiting input

Explain how electrical anomalies map to RDL nets and physical locations.
List calibration measurements, material curves, and extrapolation limits.

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How can intermittent fine-line RDL opens after thermal cycling be localized?

Problem context and interpretation

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