Your solution map
Cracking and intermittent opens in fine-line RDL after thermal cycling
Check BLNKK's understanding of the problem, then review priority paths, candidate solutions and missing conditions.
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Your solution map
Check the problem definition, then choose which solutions to explore.
2 priority paths12 candidate solutions12 sources
BLNKK's current understanding
Please check the details- Package architecture
- Fan-out / multilayer fine-line RDL; line widths, dielectrics, and via stackup unconfirmed
- Observation
- Resistance rise, intermittent opens, or suspected routing cracks during or after thermal cycling
- Evaluation stage
- Temperature-cycle reliability, fault localization, and stackup tracing
- Variables to validate
- RDL layers, bends / vias, material thermomechanical properties, substrate, and package boundaries
- Missing information
- In-cycle electrical data, failure locations, actual stackup, material curves, and good-sample controls
Paths to assess first
Paths serve different purposes and can be combined01
Dynamic electrical and RDL-location correlationNarrow intermittent opens to sampleable nets and regions
First02
RDL-stackup thermomechanical analysisCompare stress rankings across layer counts, materials, and structural boundaries
FirstCurrent candidate solutions
Sample suitability still needs confirmationFailure-localization workflowTargeted RDL physical analysis after electrical localizationASE · Can help answer: Can abnormal nets be narrowed to representative RDL regions?
→Thermomechanical analysisFOCoS fine-line RDL warpage and stress-model referenceASE · Can help answer: Which stackups and boundaries raise relative stress in this design?
→Material and structural screeningUltrafine multilayer Cu RDL mechanical-reliability research referenceFraunhofer IZM · Can help answer: Are plated-Cu and cross-substrate-region mechanical data needed?
→Next: confirm engineering conditionsUse 3 key conditions to adjust the assessment order, then choose solutions to compare.
Check engineering conditions →