Pre-bond surface readiness and release for hybrid bonding: How should the next controlled comparison be designed?

First confirm the pre-bond object and the process’s own window. Preserve the original surface and samples before and after rework.

Pre-bond surfacesCu recessPost-activation waiting

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Who validates and approves the process’s release window and inspection coverage?
Are local Cu recess and longer-scale topography comparable at the same locations?
How do exposure after cleaning/activation and rework affect the surface at the next station?

Reference sourcesBruker：AN5001 Surface Metrology for Hybrid Bonding ↗

Technical Q&A awaiting input

Who validates and approves the process’s release window and inspection coverage?
Are local Cu recess and longer-scale topography comparable at the same locations?
How do exposure after cleaning/activation and rework affect the surface at the next station?

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Pre-bond surface readiness and release for hybrid bonding: How should the next controlled comparison be designed?

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